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SMT Line

Machine

Brand

Capability

Screen Printer

MPM、FUJI、INOTIS

   Min Pad Size:03015(0.3mm*0.15mm)

3D SPI

Parmi、Pemtron、Cyber Optics

   Min Pad Size01005(0.4mm*0.2mm)

SMT Machine

FUJI、Siplace、Panasonic

   Min Component Size03015 (0.3mm*0.15mm)
 
  Flip Chip: (Min solder bump size 68 μm, Min pitch 0.13 mm)
 
  μBGA:      (Min solder bump size 0.25mm, Min pitch 0.35 mm)
 
  IC lead :   (Min pitch 0.24mm)

Reflow Oven

BTU、REHM、ERSA

   PCB Size Range50mm-550mm

AOI

Omron、Jutze、Magic Ray

   Min Component Size01005(0.4mm*0.2mm)

Wave Soldering

ERSA(Wave Soldering、Selective Wave Soldering)

   PCB Size Range50mm-550mm


Armed with advanced SMT equipment and supported by a sophisticated technical tesm, we provide extremely reliable SMT manufacturing services.

Smallest SMT component: 01005

Flip chip (minimum solder joint): 68 μm

μBGA (minimum gap between solder balls): 0.15 mm

IC lead (minimum width): 0.12 mm

Maximum PCB dimension: 500 mm × 500 mm

Minimum PCB dimension: 50 mm × 50 mm

PCB Maximum thickness: 6mm

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